Remote Principal Field Application Engineer, Advanced Packaging Job in United States Lightmatter

Who you are

• 12 years of related experience with a Bachelor’s degree; or 8 years and a Master’s degree in Engineering, Mathematics, Physics, or Computer Science (or equivalent experience)
• In-depth knowledge of Semiconductor packaging, wafer-scale packaging, and experience with UCIe, SerDes IP design, performance, and layout implications
• In-depth knowledge of 2D/3D packaging technologies such as EMIB, FoV, CoWoS and proven track record of performing trade-off analysis to meet product landing zone
• Proficient customer-facing skills and a background in effectively communicating with clients acting as the domain expert for semiconductor packaging
• Excellent business acumen, written and oral communications skills with the ability to effectively interface with management and engineering at our customers
• Must be able to travel ~30% of the time

Desirables

• Action-oriented
• Strong analytical and problem-solving skills
• Strong team-working and interpersonal skills
• Experience architecting and supporting customers who are designing advanced semiconductor packages
• In-depth knowledge of hybrid bonding, and state-of-the-art optical coupler technologies
• Passion for Lightmatter technology
• Drive to succeed

What the job involves

• Act as the primary technical interface and domain expert with customers in Lightmatter’s Advanced Packaging and optical coupler technology
• Quickly build trust and rapport within our customers' engineering teams by providing outstanding value and deliverables
• Develop and deliver technical proposals to customers, based on customer’s technical requirements and system architecture
• Perform trade-off analysis & feasibility studies across Silicon Design, Packaging technologies and systems to help define product landing zones for the customers
• Work as the field expert in Co-packaged Optics, to provide in-depth training and guidance on the packaging architecture/design to the FAE team, to create and share the related technical articles and reference designs
• Use creativity and problem-solving skills to develop solutions