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Principal Field Application Engineer, Advanced Packaging
Skills
3D PackagingOpticsSemiconductor IndustrySerdesSilicon PhotonicsSystem Architecture
What the job involves
The main requirements, responsibilities and hiring steps.
Requirements
- 12 years of related experience with a Bachelor’s degree; or 8 years and a Master’s degree in Engineering, Mathematics, Physics, or Computer Science (or equivalent experience)
- In-depth knowledge of Semiconductor packaging, wafer-scale packaging, and experience with UCIe, SerDes IP design, performance, and layout implications
- In-depth knowledge of 2D/3D packaging technologies such as EMIB, FoV, CoWoS and proven track record of performing trade-off analysis to meet product landing zone
- Proficient customer-facing skills and a background in effectively communicating with clients acting as the domain expert for semiconductor packaging
- Excellent business acumen, written and oral communications skills with the ability to effectively interface with management and engineering at our customers
- Must be able to travel ~30% of the time
Nice to have
- Action-oriented
- Strong analytical and problem-solving skills
- Strong team-working and interpersonal skills
- Experience architecting and supporting customers who are designing advanced semiconductor packages
- In-depth knowledge of hybrid bonding, and state-of-the-art optical coupler technologies
- Passion for Lightmatter technology
- Drive to succeed
Day to day
- Act as the primary technical interface and domain expert with customers in Lightmatter’s Advanced Packaging and optical coupler technology
- Quickly build trust and rapport within our customers' engineering teams by providing outstanding value and deliverables
- Develop and deliver technical proposals to customers, based on customer’s technical requirements and system architecture
- Perform trade-off analysis & feasibility studies across Silicon Design, Packaging technologies and systems to help define product landing zones for the customers
- Work as the field expert in Co-packaged Optics, to provide in-depth training and guidance on the packaging architecture/design to the FAE team, to create and share the related technical articles and reference designs
- Use creativity and problem-solving skills to develop solutions
