Remote Senior Package Layout Engineer Job in Arizona, United States NVIDIA

Who you are

• Hold a B.S. Electrical Engineering or equivalent experience
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology
• Experience with HDI designs is a plus
• Proven experience in substrate layout of wire bond and flip chip packages, preferred
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
• Validated working knowledge of high-speed design signal integrity practices
• Experience using Valor is helpful

Desirables

• Innovative
• Collaborative
• Committed
• Methodical
• Resourceful

What the job involves

• Collaborate with Technical Package Lead and design teams for IC substrate layout
• Plan schedules, resolve costs, manufacturing, and electrical design issues
• Implement high speed/density ASIC packages
• Perform substrate breakout patterns for ASIC packages
• Optimize package pinout incorporating system level trade-offs of pins assignment
• Conduct design feasibility studies to evaluate Package design goals for size, cost, and performance
• Develop methodologies to improve layout productivity
• Propose layout design trade-offs and resolve implementation issues with Technical Package Lead