Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing. The company’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined computer graphics, ignited the era of modern AI and is fueling the creation of the metaverse. NVIDIA is now a full-stack computing company with data-center-scale offerings that are reshaping industry.

NVIDIA

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions!

This position will collaborate with Technical Package Lead and different design teams in the design and development of complex, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

What You'll Be Doing

As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.Perform substrate breakout patterns for ASIC packages.Optimize package pinout incorporating system level trade-offs of pins assignment.Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.Develop symbols and CAD library databases using Cadence APD design toolsDevelop methodologies to improve layout productivity

What We Need To See

Hold a B.S. Electrical Engineering or equivalent experience5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plusProven experience in substrate layout of wire bond and flip chip packages, preferredSignificant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)Your validated working knowledge of high-speed design signal integrity practicesExperience using Valor is helpful

The base salary range is 128,000 USD - 247,250 USD. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.

You will also be eligible for equity and benefits .  NVIDIA accepts applications on an ongoing basis. 

NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.



Remote Senior Package Layout Engineer Job in California, United States NVIDIA

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