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Advanced Packaging & Power Delivery Senior Engineer
Skills
Full-Stack DevelopmentAcceleratorAnalytical SkillsCustom DesignsDesign GuidelinesEDAEnglish
What the job involves
The main requirements, responsibilities and hiring steps.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering Microelectronics or related field PhD is a plus
- 7+ years of experience in power delivery and/or advanced packaging design in semiconductor or deep-tech environments
- Demonstrated expertise in on-die power grid design and package/PCB PDN analysis
- Hands-on experience with 2.5D and/or 3D IC packaging technologies multi-chiplet integration and interposer/substrate co-design
- Proficiency with industry-standard EDA tools for power integrity PDN simulation and package design
- Ability to work cross-functionally and communicate complex technical trade-offs
- Strong written and spoken English communication skills
Nice to have
- Cross-functional
- Mentoring
- Vendor collaboration
- Technical communication
- Problem solving
Day to day
- Own end-to-end power-delivery design from on-die power grids through package and PCB PDN analysis and sign-off
- Lead advanced packaging architecture for 2.5D/3D stacking multi-chiplet integration and interposer/substrate co-design
- Collaborate cross-functionally with silicon engineering and AI integrated systems to align packaging and power solutions with product requirements
- Develop methodology flows and design guidelines while mentoring the team and engaging external vendors and OSAT partners