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Advanced Packaging & Power Delivery Senior Engineer
Skills
Full-Stack DevelopmentAcceleratorAnalytical SkillsCustom DesignsDesign GuidelinesEDAEnglish
What the job involves
The main requirements, responsibilities and hiring steps.
Requirements
- Bachelor's or Master's degree in Electrical Engineering Microelectronics or related field PhD is a plus
- 7+ years of experience in power delivery and/or advanced packaging design in a semiconductor or deep-tech environment
- Demonstrated expertise in on-die power grid design and package/PCB PDN analysis
- Hands-on experience with 2.5D and/or 3D IC packaging technologies multi-chiplet integration and interposer/substrate co-design
- Proficiency with industry-standard EDA tools for power integrity PDN simulation and package design
- Ability to work cross-functionally and communicate complex technical trade-offs to diverse stakeholder groups
- Strong written and spoken English communication skills
Nice to have
- Cross-functional collaboration
- Mentoring ability
- Analytical mindset
- Technical communication
- Detail oriented
Day to day
- Own end-to-end power delivery design across on-die power grids package PDN and PCB PDN
- Lead advanced packaging architecture for 2.5D and 3D stacking multi-chiplet integration and interposer/substrate co-design
- Perform SI PI verification and sign-off while collaborating across silicon engineering AI integrated systems and external packaging partners