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Advanced Packaging & Power Delivery Senior Engineer
Skills
Full-Stack DevelopmentAcceleratorAnalytical SkillsCustom DesignsDesign GuidelinesEDAEnglish
What the job involves
The main requirements, responsibilities and hiring steps.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering Microelectronics or related field PhD is a plus
- 7+ years of experience in power delivery and/or advanced packaging design
- Demonstrated expertise in on-die power grid design and package or PCB PDN analysis
- Hands-on experience with 2.5D and/or 3D IC packaging technologies multi-chiplet integration and interposer or substrate co-design
- Proficiency with industry-standard EDA tools for power integrity PDN simulation and package design
- Ability to work cross-functionally and communicate complex technical trade-offs
- Strong written and spoken English communication skills
Nice to have
- Cross-functional
- Mentoring
- Vendor collaboration
- Technical communication
- Problem solving
Day to day
- Own power-delivery design across the full stack from on-die grids to package and PCB PDN
- Lead advanced packaging architecture for 2.5D and 3D stacking multi-chiplet integration and interposer or substrate co-design
- Perform SI and PI verification and sign-off while partnering with silicon and systems teams to meet product requirements
- Develop and improve power-delivery methodology flows and design guidelines and engage with vendors and OSAT partners