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Advanced Packaging & Power Delivery Senior Engineer
Skills
Full-Stack DevelopmentAcceleratorAnalytical SkillsCustom DesignsDesign GuidelinesEDAEnglish
What the job involves
The main requirements, responsibilities and hiring steps.
Requirements
- Bachelor's or Master's degree in Electrical Engineering Microelectronics or related field PhD is a plus
- 7+ years of experience in power delivery and or advanced packaging design in semiconductor or deep-tech environment
- Demonstrated expertise in on-die power grid design and package PCB PDN analysis
- Hands-on experience with 2.5D and or 3D IC packaging technologies multi-chiplet integration and interposer substrate co-design
- Proficiency with industry-standard EDA tools for power integrity PDN simulation and package design
- Ability to work cross-functionally and communicate complex technical trade-offs
- Strong written and spoken English communication skills
Nice to have
- Cross-functional collaboration
- Technical communication
- Mentoring ability
- Detail oriented
- Problem solving
Day to day
- Own power-delivery design across the full stack from on-die power grids to package and PCB PDN analysis
- Lead advanced packaging architecture for 2.5D/3D stacking multi-chiplet integration and interposer substrate co-design
- Perform SI PI verification and sign-off while collaborating with silicon and integrated systems teams to meet product requirements